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      (X-ray inspection equipment, bump inspection equipment, X-ray observation equipment, solder inspection equipment)

      Equipment to inspect/judge bumps on the wafer automatically.
      By transmitting X-rays through voids (air bubbles) inside the wafer, the void diameter (area) is calculated from a transmitted image to automatically judge whether to accept voids exceeding standards.
      It uses a microfocus X-ray tube as an X-ray source, and a cutting-edge X-ray digital camera for the X-ray image receiving section, to extract high-resolution images and enable high-precision void inspection.

      Series Name

      • Six-2000/3000

      Applications

      • Inspection of bumps on silicon wafers
      • Inspection of soldered areas such as BGA on mounted substrates
      • Inspection of soldered areas flip-chip-mounted on LED
      • Inspection of voids on two-layer soldered areas of power devices (IGBT)
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      For Inquiries About This Product
      • Company:
        Shin-Etsu Engineering Co., LTD.
      • Department:
        Electro-Mechanics Division
      • Email:
        systeminfo@see.jp
      
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